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Asus GL502VS GL502VS Hauptplatine Asus GL502VS GL502VS Hauptplatine
Asus GL502VS GL502VS Hauptplatine
€280.86
NI PCI-GPIB/LP 778255-01 PCI-GPIB-Karte NI PCI-GPIB/LP 778255-01 PCI-GPIB-Karte
NI PCI-GPIB/LP 778255-01 PCI-GPIB-Karte
€358.05
IEI ROCKY-4786EVG-R30 VER:3.0 Industrie-Motherboard IEI ROCKY-4786EVG-R30 VER:3.0 Industrie-Motherboard
IEI ROCKY-4786EVG-R30 VER:3.0 Industrie-Motherboard
€145.08
IEI ROCKY-4786EVG-RS-R41 VER:4.1 Industrie-Motherboard IEI ROCKY-4786EVG-RS-R41 VER:4.1 Industrie-Motherboard
IEI ROCKY-4786EVG-RS-R41 VER:4.1 Industrie-Motherboard
€212.04
IEI ROCKY-538TXV-R7 Hauptplatine
IEI ROCKY-538TXV-R7 Hauptplatine
€358.98
SIMCOM SIM7000JC B1/B3/B5/B8/B18/B19/B26 IoT

SIMCOM SIM7000JC B1/B3/B5/B8/B18/B19/B26 IoT

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Produktdetails



  • Modellnummer： SIM7000JC
  • Herkunftsort： CHINA
  • Markenname： SIMCOM
  • Chipsatz： SIM7000X
  • Anwendung： eMTC/NB-IoT/EDGE-Modul
  • Global-Band LTE CAT-M1： AT-M1: B1/B2/B3/B4/B5/B8/B12/B13/B18/B19/B20/B26/B28/B39
  • Global-Band LTE NB-IoT1： B1/B2/B3/B5/B8/B12/B13/B17/B18/B19/B20/B26/B28
  • GPRS/EDGE： 850/900/1800/1900Mhz
  • Versorgungsspannungsbereich： 3.0V~ 4.3V, Typ: 3.8V
  • Betriebstemperatur： -40℃ bis +85℃
  • Abmessungen： 24 x 24 x 2,6 mm
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